JPH0211788Y2 - - Google Patents
Info
- Publication number
- JPH0211788Y2 JPH0211788Y2 JP9886483U JP9886483U JPH0211788Y2 JP H0211788 Y2 JPH0211788 Y2 JP H0211788Y2 JP 9886483 U JP9886483 U JP 9886483U JP 9886483 U JP9886483 U JP 9886483U JP H0211788 Y2 JPH0211788 Y2 JP H0211788Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- anode electrode
- plate
- cathode electrode
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 239000008188 pellet Substances 0.000 description 17
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 15
- 229910052750 molybdenum Inorganic materials 0.000 description 15
- 239000011733 molybdenum Substances 0.000 description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 238000007789 sealing Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9886483U JPS609225U (ja) | 1983-06-28 | 1983-06-28 | 半導体装置のシ−ル構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9886483U JPS609225U (ja) | 1983-06-28 | 1983-06-28 | 半導体装置のシ−ル構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609225U JPS609225U (ja) | 1985-01-22 |
| JPH0211788Y2 true JPH0211788Y2 (en]) | 1990-04-03 |
Family
ID=30234541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9886483U Granted JPS609225U (ja) | 1983-06-28 | 1983-06-28 | 半導体装置のシ−ル構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609225U (en]) |
-
1983
- 1983-06-28 JP JP9886483U patent/JPS609225U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS609225U (ja) | 1985-01-22 |
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